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Holitech plans to invest 1 billion yuan in India…

  • August 22, 2018March 25, 2020
  • by Minyang

On August 6, Holitech signed a memorandum of understanding with the Indian government of Andhra Pradesh on investment in electronics manufacturing in India (meaning “cooperation agreement”, hereinafter referred to as “memorandum” ). Andhra State Governor Nara Chandra Babu Naidu, Holitech President Chen Guisheng and Xiaomi India Vice-President Manu Jain and other leaders attended the signing ceremony.

According to the memorandum, Holitech plans to invest 1 billion RMB in Tirupati in southern Andhra Pradesh (the amount of investment is about counting, the specific investment method and the amount of uncertainty), and the main production camera module (CCM) Color liquid crystal display module (TFT), capacitive touchscreen module (CTP), flexible printed circuit board (FPC) and fingerprint recognition module (BR) can create about 6,000 jobs in the local area. The factory will be implemented in two phases. In the first phase, the company will invest in five production lines, which are expected to reach an annual production capacity of 50 million units and an FPC monthly production capacity of 50,000 square meters. The second phase of the investment is expected to have an annual production capacity of 100 million units and FPC monthly capacity. 100,000 square meters. Andhra Pradesh will provide the necessary assistance to Holitech to improve the investment environment, including land acquisition and infrastructure improvements, while providing attractive incentives in accordance with state government laws/regulations. The two sides promote communication and mutual development through mutually beneficial and mutually beneficial cooperation.

At present, smartphones are growing rapidly in India and other overseas markets. In order to meet the global development strategy of Holitech and the overseas development needs of first-line customers at home and abroad, Holitech is the most comprehensive company in the industry. Touchscreen, FPC, fingerprint, camera, glass cover, etc.), Wen Kaifu, chairman of Holitech Group, proactively enriched and perfected the global layout of the company’s industry. In the future, the company will play a multi-product synergy, work together with partners to actively develop and deploy overseas markets, and continue to move forward to become the continuous leader of the intelligent terminal industry chain.

News

MWC accelerates detonation of 5G era Holitech advances layout…

  • July 3, 2018March 25, 2020
  • by Minyang
June 27-29, 2018 Mobile World Congress was held in Shanghai. In this exhibition, the three major telecom operators in China announced the 5G deployment plan and combined with major communication vendors to highlight 5G core technologies and innovative applications. In addition, in line with the 5G network deployment of telecom operators, Huawei, the intelligent terminal manufacturer, has confirmed that the first 5G mobile phone will be launched in 2019, and the 5G industry has entered a comprehensive sprint phase.

Obviously, the development opportunities brought about by the 5G era are infinite. The relevant manufacturers in the mobile phone industry supply chain are aiming at the future market development, and they are arranging the 5G industry to strive to share the market dividend brought by the 5G “big cake”. Recently, Holitech, a well-known supplier of intelligent terminal parts in China, said that the company has made strategic plans and reserves for 5G terminal related materials in advance, and regarded it as an important direction for the company’s future development.

New elements of traditional products in the 5G process

As we all know, the 5G era is coming, it is more powerful in data collection and cloud big data processing, with higher communication frequency, larger bandwidth and faster response. Therefore, the performance and anti-interference requirements of each smart component in the smart terminal products in the 5G market will increase. The high-frequency and high-speed of electronic circuits puts higher requirements on the circuit board of intelligent terminals. Traditional FR4 and PI can no longer be used as carriers for high-frequency high-speed circuits, which will cause information distortion, low response speed and higher. System energy dissipation.

In addition, due to the change of the mobile phone from front to back single-shot to double-shot, the mobile phone replaces the SLR camera requirements, the fast update to three and four cameras, and the secure identification application such as Face ID that needs to quickly process large amounts of information, large-scale images. The demand for processing and high pixel content is constantly emerging, which also exacerbates the urgent need for high information volume and fast transmission. Traditional modular products also need high-frequency high-speed transmission capability to adapt to the future 5G communication requirements and obtain a perfect 5G experience.

High-screen ratio and AMOLED display are the development direction of future mobile phones. The high screen ratio leads to less space, and the increase in lines brought by high-pixel AMOLED makes COF an inevitable driver IC package for full-screen and AMOLED screens. There are no companies in the mainland that have COF technology and production capacity, especially the supply of double-sided COF. At the moment when domestic giants have launched OLEDs, there is a supply chain vacuum in COF products. In addition, in view of the high-frequency and high-speed characteristics of the 5G and the increase in the size of the display screen, the loss of power consumption is also drastically increased. The necessity of wireless charging will also be fully reflected in the 5G era, and the use of fragmentation time to charge the mobile phone anytime and anywhere will greatly support 5G applications.

Holitech, the core product at the beginning of its listing in 2014, is a touch screen and small and medium-sized LCD screens and modules. In the past few years, through the acquisition, cooperation, investment and other ways to continuously expand and improve the camera (including dual camera), biometrics, 3D glass cover, wireless charging module, all aspects of the business, has become the industry A few companies with intelligent terminal industry chain and design and mass production capabilities. Based on this, Holitech has strengthened the necessary components and materials for each intelligent terminal in the 5G era in various fields. It is worth mentioning that the author has obtained information and learned that Holitech has taken the lead in launching the strategic layout of the 5G market in 2017.

Master the core material technology layout 5G terminal

Holitech holds Shanghai Adel-link Technology Co., Ltd. (hereinafter referred to as “Adel-link”) through its subsidiary BYD Electronics. Shanghai Adel-link Technology Co., Ltd. is a high-tech enterprise with material technology as its core, high-frequency high-speed flexible circuit board and integrated circuit package substrate as the main application industry. The company has applied for more than 20 invention patents in high-frequency materials, high-frequency flexible circuit production, and new IC packaging, and has authorized 5 articles. At present, only a few companies in the world have mastered the high-frequency LCP flexible antenna mass production technology, and Adel-link is one of the companies with multi-layer LCP production technology.

LCP has a low dielectric constant and low dielectric loss. It can carry several transmission lines in a 3-layer structure of only 0.2 mm and take out multiple RF lines together, thus replacing the thick multi-coaxial cable, which can not only reduce 65. % feeder thickness, with higher space efficiency, and better overall cost, is the best choice for 5G high-frequency flexible lines.

At the same time, because the 90% screen ratio display is the development direction of the future mobile phone, COF is an essential material for the future 5G standard OLED display, which is also the company’s current development direction. Holitech utilizes unique ultra-precision mold technology and fine image transfer technology to achieve the finest line width and line spacing of 2 microns, far exceeding the technical capabilities disclosed on the market. At present, it has invested in a 1000-mu COF and high-frequency materials industrial park in Jiangxi Xinfeng.

The 5G related materials and technologies mastered by Holitech can promote the development of the company in the 5G era, and quickly apply to the company’s current industry-leading comprehensive screen modules, camera modules and other products. In the replacement of the 5G era, we seized the opportunity to maintain the leading position in the industry and build the core competitiveness of the 5G era.

Correspondingly, under the wave of the 5G era, ultra-fine line high-order FPC, wireless charging supporting materials, high-frequency high-speed materials, and absorbing materials have become indispensable materials for constructing the 5G market. Holitech will also open a new chapter in the field of circuit boards, wireless charging, and 5G materials.

Overall, with the addition of Adel-link, the development speed of Holitech will be in full swing. In addition, Holitech laid the foundation for the overall supporting update of the intelligent terminal 5G through the strategic layout of 5G related materials. Looking forward to the future, Holitech is expected to take the lead in occupying the dominant position in the next wave of industry changes and enjoy the industry dividend.

News

The world’s thinnest wireless charging transmitter will be released…

  • February 25, 2018March 25, 2020
  • by Minyang

Get rid of the shackles of wired,
Experience the feeling of freedom,
Embark on a shared journey,
Undoubtedly, we are entering a new era of wireless charging.

Come to MWC2018,
Shanghai Line Printing Technology looks forward to your collision and spark in Barcelona!

2018-02-25 Shanghai Line Printing New Materials Technology Co., Ltd.

At the beginning of the new year, the Lantern Festival was in place. Barcelona (the capital of Catalonia, Spain), a high-tech event in the mobile communications industry is about to kick off. This year’s World Mobile Communications Conference (MWC 2018) will be held from February 26 to March 1 local time in Barcelona. Due to its strong professionalism, MWC attracts a large number of top tech companies and industry giants from around the world to exhibit each year.

The world’s thinnest wireless charging transmitter module LP-1 will be released

As the leading wireless charging solution provider in China, Shanghai Line Printing Technology will exhibit its latest product and LP-1, the world’s thinnest wireless charging module solution, at this MWC. This product is based on Line Printing’s unique nanocrystalline patented technology, and undergoes special processing to match the precision winding technology, so that the overall TX coil module thickness is controlled at 1.10mm (Max).

The corresponding machine thickness can achieve the ultimate experience of 2.7mm. With the built-in desk lamp, smart home, etc., the thinnest can even challenge 1.3mm. It can meet the needs of customers to increase the wireless charging function while maintaining the simple style of the machine. It is applicable to various wireless charging transmitter application scenarios including smart home, car electronics, and portable products.

The data show that under the conditions of TX power of 13W and RX power of 10W, the efficiency of 4-layer iron-based nanocrystalline composites is comparable to that of 0.5mm ferrites; under the conditions of TX power of 18.5W and RX power of 15W, 6 layers The efficiency of iron-based nanocrystalline composites is comparable to that of 0.5mm ferrites. At this time, the thickness is only 1/5 to 1/4 of the ferrite. In addition, the weight of the iron-based nanocrystalline composite material is only 2g, which is 1/7 of that of the conventional ferrite material and is easy to carry.

45W foldable high power multi coil LP-Power

At the same time, Line Printing will also exhibit a prototype of the LPW power solution for the 45W (15Wx3) high-power multi-coil solution. The LP-Power also uses the LP-1 Ultra Slim technology, and its thinnest overall thickness will be only 2.0mm. It can support up to 21 wireless charging coils (7×3), greatly improving the freedom of user experience. Due to its split design and high-end flexible magnetic material, it can achieve foldability and bendability while reducing interference to mobile phone RF components and achieving low temperature rise (ΔT < 5°C). In addition, LP-Power prototype will also support iPhone 7.5W and Samsung 10W fast charge.

Shanghai Line Printing New Material Technology Co., Ltd., established in 2012, is currently the leader in wireless charging in China. With its deep accumulation in magnetic materials and printed electronics, Line Printing took the lead in mass production of nanocrystalline and amorphous high-end magnetic materials in China in 2015, and subsequently entered the international mobile phone giant supply chain. In 2017, the company increased its capital and expanded shares, further consolidating the strength of the entire industry chain in wireless charging. With high-end magnetic materials as the core, Line Printing provides customers with a complete solution from materials to modules (RX/TX) and finished products, and is committed to becoming a high-tech leader in wireless charging.

Line Printing will exhibit the company’s full range of products during the MWC2018 exhibition, covering high-end magnetic materials (High Bs), multi-functional (WPT/NFC/MST) receiver modules, 5W~60W, different coil sizes, IDT/NXP based, etc. A variety of IC solutions for wireless charger transmitter module and finished products, involving desktop, automotive and mobile power and other application scenarios. Welcome to guide!

News

The wireless charging industry broke out and Holitech took…

  • January 30, 2018March 25, 2020
  • by Minyang
Wireless charging, as two high-end brands Apple and Samsung continue to increase the research and development of new products and a series of products continue to launch, constantly pinching the market and the user’s imagination for the wireless charging future market space.

Daily Economic News 01-30 23:38

The new technologies of high-tech companies from the United States to Europe and even China continue to develop. New capital, new technologies and continuous accession by various vendors continue to drive rapid product updates and rapid market growth in this market. According to the prediction of the European company NXP, by 2020, the shipment of electronic devices with wireless charging capabilities will exceed 1 billion units, and the smart phone receiver and wireless charging accessories will still be the most important form of shipment. The global wireless charging market will grow from 1.7 billion U.S. dollars in 2015 to 15 billion U.S. dollars in 2024, and the market outlook is imminent and rapid.

Wireless charging As a wireless energy transmission product, the two most important factors affecting its transmission capability are magnetic materials and magnetic induction coils. Magnetic material is divided into nanocrystalline and ferrite. As a new type of polymer magnetic material, nanocrystals will occupy the mainstream position in the high-power and high-experience wireless charging products in the future, and the mainstream of the market has been optimistic about this high-tech nanocrystal product. Holitech is one of the few companies in the world that has nanocrystalline core technology capabilities and high-volume production capacity, with a global competitive advantage.

Another core element of wireless charging – magnetic induction coil, there are two kinds of high current FPC coil and precision metal coil. FPC has many advantages such as good consistency, easy assembly and flexible design. The precision metal coil has the advantages of superior electrical performance and simple design. The two types of magnetic induction coils will coexist for a long time depending on the product requirements. Holitech has the leading core R&D advantages and large-scale production of these two products.

Among domestic listed companies, Holitech is one of the few companies that has deployed wireless charging in advance and has mass production capacity. Based on a comprehensive understanding of the core resources of wireless charging technology and a full range of solutions, the company has completed relevant investment plans and preparations. Relying on the existing customer resources of Holitech, Holitech has deployed large-scale wireless charging automation plants (nanocrystals, magnetic induction coils, assembly plants) in Wanan, Xinfeng, etc. in Jiangxi Province, which is expected to greatly satisfy the company’s requirements. Demand for customer deliveries; at the same time, skilled production processes and mass production capacity are currently in place.

Holitech precisely targets wireless charging, conforms to industry trends, firmly occupies a strategic leading position in wireless charging core materials such as nanocrystalline, magnetic coils, and automated factories, establishes its own competitive advantage in wireless charging, and is determined to become a global leader. The industry leader. Holitech stated that it will continue to invest in research and development of new technologies and applications, and maintain and strengthen the company’s top position in the wireless charging industry as a supplier of quality materials, modules and finished products. This is also an important mission for the company’s long-term development.

In recent years, Holitech has always adhered to the “1+N” development strategy and has completed a strategic transformation from a single operation to a diversified and globalized one. The growth in performance and the momentum of business development can be described as rapid. In 2016, Holitech‘s annual net profit amounted to 874 million yuan, an increase of 300.72% year-on-year; the 2017 full-year performance is expected to continue to maintain a high growth trend. In addition, the production and sales volume of the company’s main products have been continuously improved, and the penetration rate of customers has also increased year by year. This not only shows the continuous and steady development of Holitech‘s main business, but also proves the forward-looking vision of the company’s strategic layout over the years and its determination to be a first-rate company. Holitech, which is at the forefront of the domestic smart terminal core component industry, has always focused on using its own superior resources, serving core customers through product value, and growing together with customers, and will become a full beneficiary of the sustainable development of the industry.

2018 can be described as the first year of the domestic wireless charging market. It can be imagined that free user experience will make wireless charging an irreversible trend in the future. Many leading manufacturers at home and abroad are leading the trend, changing consumer lifestyles, maturing wireless charging technology, and capital investment of related companies. These four factors will jointly “detonate” the huge market of mobile phone wireless charging industry.

News

Holitech: FPC Signal Acquisition Line Boosts Large-scale Production of…

  • January 5, 2018March 25, 2020
  • by Minyang

Summary
In recent years, with the vigorous development of the new energy automotive industry, Holitech has benefited from the good cooperation relationship with BYD Auto, and has cooperated in the early stage of its new energy vehicle research and development to jointly realize the FPC of sampling harnesses and mass production use. It also boosted the mass production of BYD auto power batteries.

[Soundon New Energy • Hot Spot] 2018-01-05 Wan Pingping High-tech lithium battery

Driven by the strong demand of policies and downstream market demand, the increase in power battery energy density and large-scale production are imminent. Power battery companies and their upstream suppliers are making unremitting efforts to achieve this goal.

Holitech (002217) is one of the representatives. Compared with traditional wire harnesses, the production process of the company’s FPC signal acquisition line is basically automated, with high production efficiency and high dimensional accuracy, and is suitable for large-scale mass production.

In the power battery assembly stage, the FPC signal acquisition line can be directly positioned in the structure by the robot’s grasping, making it possible to automate the assembly of the power battery; while the thin and light structure, soft and bendable, the design space is compact, the assembly is free The degree of improvement can also provide some help in lightening the battery pack. For manufacturers that are eager to achieve automated assembly of battery module assemblies, the FPC signal acquisition line will be the best choice.

According to the person in charge of Holitech, “From 2003 to now, we have provided long-term services to the 3C industry, including domestic first-line brand mobile phone customers (Huawei, OPPO, etc.) and numerous foreign customers. The Holitech FPC is a dual clutch transmission, headlight, and lighter in traditional fuel vehicles. Control panels and various vehicle sensors have also been used in large quantities.”

In recent years, with the vigorous development of the new energy automotive industry, Holitech has benefited from the good cooperation relationship with BYD Auto, and has cooperated in the early stage of its new energy vehicle research and development to jointly realize the FPC of sampling harnesses and mass production use. It also boosted the mass production of BYD auto power batteries.

As we all know, under the trend of subsidy retreat, power batteries are facing tremendous pressure to quickly reduce costs.

In response, the responsible person stated that under the premise of satisfying safety and reliability, Holitech will help customers optimize structural design, reduce FPC footprint, and reduce the use of patch devices such as metal terminals; generally, wiring adjustments can be made. The FPC is designed as a single panel with a simple process and low cost.

“The cost is designed. We sincerely hope to work with customers to make overall adjustments to the design, assembly and testing of the battery structure, and help customers to optimize the cost of adopting the FPC signal acquisition scheme.”

With a strong service team integrating R&D, design and production, and years of experience in FPC production and research and sales, it has laid a solid foundation for the rapid development of Holitech. In response to growing demand for orders, Holitech is aggressively expanding its production capacity.

Ligong Li-Ion learned that in the past three years, Holitech has invested a large amount of funds for the automation and technological transformation and expansion of Shenzhen factory; the total investment is 4.5 billion yuan, and the Xinfeng circuit board industrial park to be put into operation will become the largest and global Three soft board, soft and hard board R & D production and sales base. All these will provide a strong guarantee for the growth of FPC business.

Holitech said: “We will actively serve customers with high-volume, standardized operations, automated layout awareness of power battery customers, to help such customers’ automated production.”

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