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Holitech plans to invest 1 billion yuan in India…

  • August 22, 2018March 25, 2020
  • by Minyang

On August 6, Holitech signed a memorandum of understanding with the Indian government of Andhra Pradesh on investment in electronics manufacturing in India (meaning “cooperation agreement”, hereinafter referred to as “memorandum” ). Andhra State Governor Nara Chandra Babu Naidu, Holitech President Chen Guisheng and Xiaomi India Vice-President Manu Jain and other leaders attended the signing ceremony.

According to the memorandum, Holitech plans to invest 1 billion RMB in Tirupati in southern Andhra Pradesh (the amount of investment is about counting, the specific investment method and the amount of uncertainty), and the main production camera module (CCM) Color liquid crystal display module (TFT), capacitive touchscreen module (CTP), flexible printed circuit board (FPC) and fingerprint recognition module (BR) can create about 6,000 jobs in the local area. The factory will be implemented in two phases. In the first phase, the company will invest in five production lines, which are expected to reach an annual production capacity of 50 million units and an FPC monthly production capacity of 50,000 square meters. The second phase of the investment is expected to have an annual production capacity of 100 million units and FPC monthly capacity. 100,000 square meters. Andhra Pradesh will provide the necessary assistance to Holitech to improve the investment environment, including land acquisition and infrastructure improvements, while providing attractive incentives in accordance with state government laws/regulations. The two sides promote communication and mutual development through mutually beneficial and mutually beneficial cooperation.

At present, smartphones are growing rapidly in India and other overseas markets. In order to meet the global development strategy of Holitech and the overseas development needs of first-line customers at home and abroad, Holitech is the most comprehensive company in the industry. Touchscreen, FPC, fingerprint, camera, glass cover, etc.), Wen Kaifu, chairman of Holitech Group, proactively enriched and perfected the global layout of the company’s industry. In the future, the company will play a multi-product synergy, work together with partners to actively develop and deploy overseas markets, and continue to move forward to become the continuous leader of the intelligent terminal industry chain.

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